Personal tools
Home Events Events Archive 2014 High-speed 3D Laser Lithography for 3D micro- and nanofabrication

High-speed 3D Laser Lithography for 3D micro- and nanofabrication

— filed under:

  • Visitor Seminars
When Feb 11, 2014
from 01:00 PM to 03:00 PM
Where Engr. IV Bldg., Maxwell Room 57-124
Contact Name
Add event to calendar vCal

Dr. Wanyin Cui

Nanoscribe GmbH, Germany

Keywords:  2-photon polymerization (2PP), 3D µ-printing, direct laser writing (DLW)  


Three-dimensional (3D) direct laser writing (DLW) based on two-photon polymerization enables versatile fabrication of micro- and nanostructures for a large variety of applications [1, 2]. Nowadays, DLW has been established as workhorse in many scientific research laboratories covering the demands of research areas such as photonics, micro-optics, microfluidics, tissue engineering, optical telecommunications and mechanical metamaterials.

Here, we present the combination of our technical advantages of DLW to meet more of the high demands of 3D micro- and nanofabrication in the scientific community and industry. (i) Highest resolution is achieved by the use of high-NA objectives, which allow for feature sizes down to 150 nm. (ii) Ultra-high precision positioning for 3D structuring carried out either by means of a piezo scanning relative to a fixed laser focus or by depleting the laser beam inside the photoresist. (iii) High-speed fabrication based on the latter scanning mode has been enabled by the integration of a galvo mirror system that deflects the laser beam for typical writing speeds of 20 mm/s or better. (iv) Limited structural heights due to the working distance of microscope objectives have been overcome with the in-house developed 3D Dip-in Laser Lithography (DiLL) [3].

The combination of these developments paves the way for a broad range of applications. Here, we present results achieved by means of our 3D Laser Lithography system on 3D photonic crystals [4], artificial extracellular matrices for tissue engineering [5], micro- and nanofludic devices for microchannels, magnetic helical micromachines [6], photonic wire bonding and mechanical metamaterials. The following figures exemplified some of the above mentioned applications for an illustrative overview of the applicability of our DLW technology. Moreover, we evaluate fabrication possibilities of photonic colorized materials and diffractive optical elements potentially employed for security labels and sensors.

[1] S. Kawata et al., Nature 412 (2001), 697


[3] T. Bückmann et al., Adv. Mater., 24 (2012) 2710

[4] J.H. Atwater et al., Appl. Physics Letters, 99 (2011) 151113

[5] F. Klein et al., Adv. Mater., 22 (2010) 868

[6] S. Tottori et al., Adv. Mater. 24 (2012) 709

Document Actions