Subramanian S. Iyer

Subramanian S. Iyer

Subramanian S. Iyer
Distinguished Chancellor’s Professor &
Charles P. Reames Endowed Chair
Primary Area: Physical and Wave Electronics
Secondary area: Circuits and Systems

Office: 56-147H Engr. IV
Phone: (310) 825-6913
E-mail:
Research Lab: http://www.chips.ucla.edu/

Research and Teaching Interests:
System Scaling Technology, advanced packaging and 3D integration, technologies and techniques for the memory subsystem integration and neuromorphic computing

 

Awards and Recognitions
2012 IEEE Daniel Noble award for Emerging Technologies
2011 Asian-American Engineer of the Year (awarded by the Society of Chinese Engineers in 2011)
2010 IBM Fellow
2009 IBM Master Inventor
2004 Distinguished Alumnus of the Indian Institute of Technology, Bombay
2002 IBM Distinguished Engineer
Two IBM Corporate awards for the development of embedded DRAM and electrical Fuses
Four IBM Outstanding Technical Achievement awards for development of the first SiGe base HBT, “Salicide”, eDRAM and eFUSES
30 Invention Plateaus at IBM.
1995 IEEE Fellow

 

Selected Publications
  • Iyer, S.S. “Three-dimensional integration: An industry perspective” (2015) MRS Bulletin 40 (3) pp225-232 (2015)
  • S Rosenblatt, D Fainstein, A Cestero, J Safran, N. Robson,T. Kirihata and S.S. Iyer, (2013) “Field tolerant dynamic intrinsic chip ID using 32 nm high-K/metal gate SOI embedded DRAM” IEEE JSSCC 48(4) pp940-947.
  • S.S. Iyer, “The evolution of dense embedded memory in high performance logic technologies”, (2012) IEDM Proceedings pp 33.1.1-33.1.4
  • Farooq, M. G., & Iyer, S. S. (2011), “3D integration review”. Science in China 54(5), 1012-1025 (2011)
  • Iyer, S. S., Freeman, G., Brodsky, C., Chou, A. I., Corliss, D., Jain, S. H., … & Agnello, P. (2011). 45-nm silicon-on-insulator CMOS technology integrating embedded DRAM for high-performance server and ASIC applications. IBM Journal of Research and Development, 55(3), 5-1.
  • Barth, J., Reohr, W. R., Parries, P., Fredeman, G., Golz, J., Schuster, S. E., … & Iyer, S. S. (2008). A 500 MHz random cycle, 1.5 ns latency, SOI embedded DRAM macro featuring a three-transistor micro sense amplifier. Solid-State Circuits, IEEE Journal of, 43(1), 86-95.
  • Kirihata, T., Parries, P., Hanson, D. R., Kim, H., Golz, J., Fredeman, G., … & Iyer, S. S. (2005). An 800-MHz embedded DRAM with a concurrent refresh mode. Solid-State Circuits, IEEE Journal of, 40(6), 1377-1387
  • Kothandaraman, C., Iyer, S. K., & Iyer, S. S. (2002). Electrically programmable fuse (eFUSE) using electromigration in silicides. Electron Device Letters, IEEE, 23(9), 523-525
  • Powell, A. R., & Iyer, S. S. (1994). Silicon-Germanium-Carbon Alloys Extending Si Based Heterostructure Engineering. Japanese journal of applied physics, 33(part 1), 2388-2391.
  • Iyer, S. S., & Xie, Y. H. (1993). Light emission from silicon. Science, 260(5104), 40-46.
  • Gennser, U., Kesan, V. P., Iyer, S. S., Bucelot, T. J., & Yang, E. S. (1990). Resonant tunneling of holes through silicon barriers. Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 8(2), 210-213.
  • Iyer, S. S., Patton, G. L., Stork, J. M., Meyerson, B. S., & Harame, D. L. (1989). Heterojunction bipolar transistors using Si-Ge alloys. Electron Devices, IEEE Transactions on, 36(10), 2043-2064.
  • Iyer, S. S., Metzger, R. A., & Allen, F. G. (1981). Sharp profiles with high and low doping levels in silicon grown by molecular beam epitaxy. Journal of Applied Physics, 52(9), 5608-5613.