IBM AI Hardware: Packaging to the Core on October 12, 2018.

Speaker: Dr. Rama Divakaruni Affiliation: IBM Distinguished Engineer Abstract: AI workloads are strongly driving systems to become much more architecturally diverse. Today‚Äôs accelerators are composed of a mix of heterogeneous components including CPUs, GPUs, specialized accelerators, and memories. Advanced packaging techniques to enable high inter-connectivity among these components will be crucial for continued progress in … Continue reading IBM AI Hardware: Packaging to the Core on October 12, 2018.