ECE Newsletter – November 18, 2024

News  |  November 18, 2024

In collaboration with TAMU, Ozcan Lab published a new paper in ACS Sensors on an Insertable Sensor for Continuous Monitoring of Glucose and Oxygen in humans

Please see the full article.

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Ozcan Lab published a new paper on the design of a unidirectional imaging system that permits image formation only in one direction and blocking it in the reverse direction

Please see the paper and news release.

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Professor Puneet Gupta gave a Plenary Talk at the Lithography Workshop

Professor Puneet Gupta gave a plenary talk titled “Scale-out Chiplet-based Systems: Architecture, Design and Pathfinding” at the Lithography Workshop held in Rancho Bernardo, California on November 4, 2024.

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Welcome Back, Professor Subramanian Iyer!

We’re excited to announce the return of Professor Subramanian Iyer to UCLA! Recently, the National Advanced Packaging Manufacturing Program (NAPMP) made a huge splash with a $1.6 billion R&D funding opportunity. This could completely change the game for advanced packaging. Professor Iyer and his brilliant team of engineers were the driving force behind this groundbreaking program. They crafted the vision, strategy, and blueprint for the National Advanced Packaging Piloting Facility (NAPPF), which is set to become a hotbed of innovation and research for years to come.

Back at UCLA, Professor Iyer is excited to reconnect with students, faculty, and industry partners—and perhaps explore new research directions. 

We look forward to the exciting contributions and insights that Professor Iyer brings back to our campus community. Welcome back, Professor Iyer!

Please see post on Linked In. 

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Events/Seminars

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Upcoming PhD Oral Defenses

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Job Opportunities

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Design Verification Engineer at Apple

Do you have a passion for invention and self-challenge? This position gives you an opportunity to be a part of one of the most cutting edge and key projects that Apple’s Silicon Engineering Group has embarked upon to-date. As a Design Verification Engineer on their team, you’ll be at the center of the verification effort within our silicon design group responsible for crafting and productizing state-of-the-art Cellular SoCs!

You will have the opportunity to contribute to the verification effort of a set of complex SOCs delivering the Cellular solution. You will integrate multiple sophisticated IP level DV environments, craft highly reusable best-in-class UVM based test bench, implement effective coverage driven and directed test suites, deploy new tools and methodologies to deliver chips that are right-first-time. By collaborating with other product development groups across Apple, you can push the industry boundaries of what cellular systems can do and improve the product experience for our customers across the world!

Through this experience, you will learn all aspects of a large scale SOC design, Complex verification test benches, different types of SOC architectures, multiple high speed protocols, industry-standard low power architecture, best in class DV methodology, verification on accelerated platforms, knowledge on Cellular protocol, FW-HW interactions, complexities of multi-chip SOC debug architecture, etc.

Key Qualifications:

MS in EE or CS. Coursework in Digital Design, Computer Architecture, Object Oriented Programming, Networking Protocol. Programming experience in SystemVerilog or Python or C++ or Java.

Must be graduating by Dec ’24.

Please send your resume to j_lou@apple.com.

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Electronics/PCB Development Undergraduate Internship Opportunity

Employment Period: Year-round

Location: On-campus

Approximate hours per week: 5+ hours

Duration: 6-24 months

Salary / Pay rate / Stipend: $20/hour

Relevant Website: https://www.edroplets.org/

Job description

Digital microfluidics is a technology that enables programmable control over individual droplets using electrical signals on a chip, which has been transforming wet labs towards the era of lab-on-a-chip. You will develop electronic control circuits for operating digital microfluidics chips. This is a highly engineering-oriented project, which requires independent schematic design, PCB layout design, PCB manufacturing, and assembly outsourcing for various circuits and electronic systems. You will also work with the mechanical design and software development team guided by graduate students to create multiple products. These products will be used by numerous digital microfluidics researchers and startups around the world through an open-source platform (edroplets.org).

For domestic students (US Citizen or Permanent Resident), the payment may be a stipend from the National Science Foundation (NSF) Research Experiences for Undergraduates (REU) program. 

For international students, the payment will be through a regular research fund.

For those who prefer research credits over stipends, SRP 99 or MAE 199 is also possible.

What you will get:

(1) You will experience creating a real-world electronic product for a transformative technology, which will be used by lots of real users!

(2) You will get hands-on experience and training in schematic/PCB/electronics design and development

(3) You will learn the basic knowledge and industry status of digital microfluidics, and participate in translating ground-breaking research into real-world products

(4) You may become a co-author of resulting journal and conference publications

Quality & skill desired:

(1) A strong and genuine interest in electronics is essential. If you are a DIYer who loves working with electronics and wants to build something impactful, this is a perfect project for you.

(2) Enjoy working in a team with different expertise is essential. The ability to articulate your work to non-technical team members is essential.

(3) Experience with Altium Designer, KiCAD or other PCB design software is a plus. Experience with LabView is a plus. Experience in making a PCB from design to manufacturing is a huge plus.

(4) No experience or knowledge of digital microfluidics is required

Interested? Please send your resume to Professor CJ Kim (cjkim@ucla.edu) and Leo Wang (wangqining265@gmail.com). If there’s a good match, you will be invited to an interview.

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Newsletter Submissions

To be included in future newsletters, please send the latest news, awards, publications and any upcoming PhD oral defenses to the Chair’s assistant, Winda Mak, at wmak@seas.ucla.edu. Please include “newsletter submission” in the subject line. The ECE newsletters will be sent bimonthly on the first and third Mondays of the month. Please ensure all submissions are received by the Wednesday before distribution to be included in the newsletter.