UCLA CHIPS and the Thermal Science Lab showcased research at the 2026 IEEE Electronic Components and Technology Conference (ECTC) in Orlando, Florida. Presentations featured advances in Cu-Cu 3D integration, liquid metal probe technologies, photonic connectors, and microchannel thermal management.
Featured presentations included:
- INTERCEPT™ – A Nondestructive Known Good Die Testing Probe Samuel Wang
- Fine Pitch Cu-Cu TCB for 3D Integration Vineeth Harish
- Flash Boiling of Methanol in Silicon Microchannel Thermal Dissipation Unit for Thermal Management – Naarendharan Meenakshi Sundaram
- Photonic Dielet Integration into Electrically Active Flextrate for High Bandwidth Connectors – Alexis Samoylov