We’re happy to share that UCLA CHIPS has been named to the first cohort of SPARC, the Semiconductor Research Corporation’s new industry-funded research program (announced this month). CHIPS joins in the advanced packaging track — a natural fit for our work in heterogeneous integration. SPARC kicks off with 21 projects and over $13 million in funding, and its first call drew nearly 500 proposals from 121 universities. What makes it stand out: it’s entirely industry-funded, a model we’re excited to see grow.