Chemical Engineering 234
Principles of Plasma Processing
Offered every other year. Last given in Spring, 2004
Course ID: 574165200
Instructors: Professor Jane P. Chang 5532-D Boelter Hall
Professor Francis F. Chen 56-147M Engr. IV
Hours: ChE: 3-5 PM Wed., 5532D BH (Chang)
Plasma processing is widely used in the microelectronics industry for deposition of thin film material (metal and dielectrics) and for etching of sub-100nm features. The course addresses the fundamental physical and chemical aspects of a plasma, its applications to semiconductor fabrication, and its measurement techniques.
Textbook: F.F. Chen and J.P Chang, Lecture Notes on Principles of Plasma Processing (Kluwer/Plenum, 2003). ISBN 0-306-47497-2.
Highly recommended reference books:
M. A. Lieberman and A. J. Lichtenberg, Principles of Plasma Discharges and Materials Processing (Wiley, 1994).
F. F. Chen, Intro. to Plasma Physics and Controlled Fusion, Vol. 1, 2nd ed. (Plenum, 1984).
B. Chapman Glow Discharge Processes, (Wiley, 1986)
Homework: Six homework sets.
Grading: Homework 25%; 2 exams, 25% each; one final