Speaker: Muhannad Bakir
Affiliation: Georgia Tech
Abstract: Arguably, there has never been a more exciting time in the field of microelectronics in which so many revolutionary, rather than evolutionary, technologies are needed to continue performance scaling. This seminar will focus on innovative system integration technologies and architectures. First, we present a 2.5D integration platform for high-performance computing systems using “interposer bridging” in which a silicon interposer is used to bridge multiple packages in order to attain high-bandwidth density and low-energy ‘off-package’ communication; in such manner, we can form large scale contiguous silicon systems with dense interconnects; frequency- and time-domain measurements of the 2.5D system are presented. Second, we present 3D stacking architectures featuring submicron diameter TSVs along with modeling frameworks for power delivery and thermal maps for the quick analysis (i.e., ‘what if’ type questions) of technology parameters on performance. Moreover, we discuss and experimentally present air-gap based thermal isolation in 3D ICs for local thermal decoupling of temperature sensitive devices. We also present advanced cooling architectures for 3D ICs including the first experimental integration of monolithic microfluidic cooling into a 28 nm Stratix V FPGA and report the resulting throughput and temperature improvements. Lastly, we briefly discuss our recent work in 3D stacked biosensor platforms for cellular monitoring.
Biography: Muhannad Bakir is an Associate Professor in the School of Electrical and Computer Engineering at Georgia Tech. His areas of interest include three-dimensional (3D) electronic system integration, advanced cooling and power delivery for 3D systems, biosensors and their integration with CMOS circuitry, and nanofabrication technology. Dr. Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, 2012 DARPA Young Faculty Award, and 2011 IEEE CPMT Society Outstanding Young Engineer Award. In 2015, Dr. Bakir was elected by the IEEE CPMT Society to serve as a Distinguished Lecturer for a four-year term. Dr. Bakir and his research group have received more than 20 conference and student paper awards including five from the IEEE Electronic Components and Technology Conference (ECTC), four from the IEEE International Interconnect Technology Conference (IITC), and one from the IEEE Custom Integrated Circuits Conference (CICC). Dr. Bakir’s group was awarded the 2014 Best Paper of the IEEE Transactions on Components Packaging and Manufacturing Technology in the area of advanced packaging. Dr. Bakir is an Editor of IEEE Transactions on Electron Devices and an Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology.
Date(s) - Nov 16, 2015
1:00 pm - 2:00 pm
EE-IV Shannon Room #54-134
420 Westwood Plaza - 5th Flr., Los Angeles CA 90095