Speaker: Dr. Beth Keser
Affiliation: Intel, Director of Packaging & Systems Technology (Germany and USA)
IEEE Distinguished Lecturer Series
Followed by informal discussion session with food and refreshments in the Maxwell Room (Engr. IV, Room 57-124) with food provided by ECEGAPS
The future of electronic packaging is bright as Moore’s Law wanes and many new applications depend on advanced packaging solutions rather than the next transistor node for improved performance. Current mechanical, thermal, material, and electrical issues will multiply as solutions are required for System-in-Package integration, high reliability, low power, low loss, good thermal and electrical performance, and optimized cost and footprint. Advances in Fan-Out Wafer and Panel Level Packaging are adding value to the mobile, automotive, and IoT industries, but new package architectures and designs are needed to address 6G mmWAVE, Autonomous Driving, Artificial Intelligence, and Virtual/Augmented Reality. The 5G packaging challenges of low latency, cost, thermals, and optimized form factor and power along with good coverage will only be exacerbated at 6G. There are many packaging challenges ahead and significant advancements will be required in interdisciplinary research over the next 20 years.
Beth Keser, Ph.D., a recognized global leader in the semiconductor packaging industry with over 20 years of experience, received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 28 patents and patents pending and over 40 publications in the semiconductor industry. Previously, Beth led Qualcomm’s Fan-Out and Fan-In Wafer Level Packaging Technology Development and NPI Group for over 7 years where her team qualified over 50 products resulting in over 7 billion units shipped–technology consumers around the world enjoy in cell phones today. Based in San Diego, Beth leads the Packaging & Systems Technology department in the Platform & Engineering Systems Group in Munich, Germany and Intel USA locations.
For more information, contact Steven Moran at .
Date(s) - Feb 19, 2019
4:00 pm - 5:00 pm
EE-IV Shannon Room #54-134
420 Westwood Plaza - 5th Flr., Los Angeles CA 90095