Development of FlexTrateTM and Demonstration of Flexible Heterogeneously Integrated Low Form-Factor Wireless Multichannel Surface Electromyography (sEMG) Device

Speaker: Arsalan Alam
Affiliation: Ph.D. Candidate

Via Zoom:   : https://zoom.us/s/97228690706?pwd=S3BIa00rWWJwM2Z2NWFKRVE3WUV5dz09

Abstract:  Leading edge applications such as neural implanted prosthetics and next-generation IoT devices require the integration of high performance and low power logic, memory and sensors at high interconnect density that is not possible using conventional printed flexible electronics. As flexible applications mature, we will demand that they have more “smarts” which will require leading edge CMOS electronics, leading edge RF electronics, advanced sensors and power management. There is a need to develop a robust and flexible electronics packaging platform that will enable the unrestricted integration of state-of-the art components (processors, memories, sensors, data transmitters and receivers, power sources etc.) including high-performance components on flexible substrates that are biocompatible (including implantable), with the ability to miniaturize, interconnect at high density with acceptable reliability, and the ability to scale up in manufacturing at economical and cost-effective price points.

Considering all the above requirements, in this work, a fine pitch (≤ 40 µm), highly flexible and reliable heterogeneous integration platform called the FlexTrate^TM is investigated. The fabrication and assembly processes necessary for such a platform are developed. FlexTrate^TM is based on a dielet-first flexible Fan-Out Wafer-Level Packaging (FOWLP) approach where Polydimethylsiloxane (PDMS) is used as a molding compound to embed the heterogeneous dielets and integrate them with mechanically robust vertically corrugated interconnects at 20-40 µm pad pitches without the use of solder. FlexTrate^TM is demonstrated to be bendable to 1 mm bending radius for over 1000s of bending cycles and foldable without degradation in the system’s electrical performance. In addition, the benefits of the FlexTrate^TM style integration for system performance and flexibility are demonstrated through 200 dies integrated at 40 µm pad pitches, a foldable display, and demonstration of a wearable system in the form of wireless multi-channel surface electromyography (sEMG) system. The sEMG system can be attached to the skin to record quality sEMG signals through dry electrodes and transmits data via Bluetooth low energy (BLE). We evaluated RMS, mean frequency (MNF), and muscle fiber conduction velocity (MFCV) of the bicep muscle using this device. The ability to acquire these signals through our device in a mobile setting is critical for the study of many muscular physiological phenomena and disorders.

Biography:  Arsalan Alam received the B.Tech. degree in Electronics and Communication Engineering from the Zakir Hussain College of Engineering and Technology, India, in 2011, and the M.Tech. degree in Microelectronics and VLSI from IIT Roorkee, India, in 2015. He was a visiting student researcher at King Abdullah University of Science and Technology, Saudi Arabia, in 2016. He is currently pursuing the Ph.D. degree with the Center for Heterogeneous Integration and Performance Scaling (CHIPS) group at University of California, Los Angeles. His current research interests include the development of FlexTrate^TM which is a bio-compatible, physically-flexible platform that allows for heterogeneous integration using Fan-Out Wafer Level Packaging (FOWLP) technique for the development of next generation high-performance implantable and wearable applications.

For more information, contact Prof. Subramanian Iyer (s.s.iyer@ucla.edu)

Date/Time:
Date(s) - Mar 08, 2021
10:00 am - 12:00 pm

Location:
Via Zoom Only
No location, Los Angeles
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